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Copper Foil / Copper Alloy

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Compound Semiconductors and Crystal Materials

Compound Semiconductors and Crystal Materials

InP Substrates
CdZnTe (CdTe) Substrates
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Rutile Titanium Dioxide (TiO₂)
YAG Ceramics for Laser Applications

Metal and Compound Powders

Metal and Compound Powders

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Special Ceramic Powders

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High Purity Metals

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Upinorg (high-purity copper sulfate)

Electroless UBM Plating Service

Stainless steel

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Shielding Materials

3D formable Sheets for Electromagnetic Shielding（Mighty Shield^®）
Sn-Cu-PET foil for electromagnetic shielding

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Nonferrous Metals and Chemical Products

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Products Under Development

Special Ceramic Powders
3D formable Sheets for Electromagnetic Shielding（Mighty Shield^®）
Metal Powders for Additive Manufacturing
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Lead-free Piezoelectric Powder Material
AlSc Sputtering Target
YAG Ceramics for Laser Applications

Semiconductors and Sensors

Semiconductors and Sensors

For Front-end (Wafer) Processes

Sputtering Targets for Semiconductors
AlSc Sputtering Target
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Sputtering Targets for Optical Films
High Purity Chlorides
Lead-free Piezoelectric Powder Material
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For Back-end (Assembly) Processes

Copper Alloys for Lead Frames
Surface Treatment Agents
Upinorg (high-purity copper sulfate)
Electroless UBM Plating Service
Low α Tin
Rolled Copper Foil for Graphene

Compound Semiconductor Substrates

InP Substrates
CdZnTe (CdTe) Substrates

Circuit Boards

Treated Rolled Copper Foil
Electro-deposited Copper Foil
Surface Treatment Agents
Upinorg (high-purity copper sulfate)
Tantalum and Niobium Materials
Negative Thermal Expansion Material ZrW₂O₈
Low α Tin
High Strength Copper Alloys for Sockets

Assembly

Negative Thermal Expansion Material ZrW₂O₈
High Purity Metals
Tantalum and Niobium Materials
Low α Tin
Electroless UBM Plating Service

Displays

Sputtering Targets for Transparent Conductive Films
Sputtering Targets for Optical Films
Rolled Copper Foil for Graphene

Batteries and Energy

Batteries and Energy

Rolled Copper Foil HS1200 / HS1200-V2
InP Substrates
CdZnTe (CdTe) Substrates
Strontium Titanate (SrTiO₃)
Rutile Titanium Dioxide (TiO₂)
Tantalum and Niobium Materials
High Purity Chlorides
Rolled Copper Foil for Graphene

Additive Manufacturing

Additive Manufacturing

Metal Powders for Additive Manufacturing

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Surface Treatment Agents

Magnetic Devices

Magnetic Devices

Sputtering Targets for Magnetic Devices

Electromagnetic Shielding

Electromagnetic Shielding

Sn-Cu-PET foil for electromagnetic shielding
3D formable Sheets for Electromagnetic Shielding（Mighty Shield^®）

Communications

Surface Treatment
AlSc Sputtering Target
InP Substrates
Strontium Titanate (SrTiO₃)
Rutile Titanium Dioxide (TiO₂)
Tantalum and Niobium Materials

Optics

Sputtering Targets for Transparent Conductive Films
Sputtering Targets for Optical Films
InP Substrates
CdZnTe (CdTe) Substrates
Strontium Titanate (SrTiO₃)
Rutile Titanium Dioxide (TiO₂)
YAG Ceramics for Laser Applications
Tantalum and Niobium Materials
High Purity Chlorides

Camera Modules

Copper Titanium Alloy
Sputtering Targets for Optical Films
High Purity Chlorides

Piezoelectricity

Piezoelectricity

AlSc Sputtering Target
Lead-free Piezoelectric Powder Material

Thermal Control

Thermal Control

Copper Alloys for Cooling Modules
Negative Thermal Expansion Material ZrW₂O₈
MoSi₂ Heater
Rolled Copper Foil for Graphene

Message from the Management
Policy
Quick Guide to JX Advanced Metals
Business Segments
Corporate Data
Organization and Executive Officers
Corporate History
Operating Sites and Group Companies
Long-Term Vision and Medium- to Long-term Business Strategies and Business Targets
Purchasing Information

Products and Services

Search by Category
Search by Keyword

Research and Development

Our Core Technologies Contributing to Societal Growth and Innovation
Initiatives for Co-creation
Collaboration in the Group
SQUARE LAB

Message From the President
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